Technology

Day in and day out, we build countless PCB's that incorporate blind, buried, filled, planarized and plated shut vias.


We also build several designs that utilize pocket cavities. To insure quality, all panels contain reliability coupons per IPC-2221 that are used for both in process and final inspection criteria.

Capabilities

Download Capabilities Sheet


* Six drill machines, up to 300K/RPM spindles for mechanical drilling uVia's (0.004" diameter)

* CCD drilling and routing capability for higher precision as well as backdrill depth control

* Pneumatic via fill to improve speed, quality, and consistency of via fill process

* Automated planarization equipment to enable tighter control of copper removal during the process.

* Glenbrook X-Ray machine for optimizing drill registration and examining cross sections

* CMI 165 for fast, accurate, inline measurement of copper thickness

* DP 1500 screen printer for improved screening consistency and cosmetics

* Reverse Pulse Plating for high aspect ratio and uniform plating consistency on surfaces and holes

* New flying probe tester for additional capacity and redundancy

* Dynachem Cut Sheet Laminator

* Fabcon ATI-30 four camera optical registration imaging system

* Multiline Post Etch Punch

Equipment

In pursuit of our quality goals, Netvia Group has invested heavily in equipment and training.


Our advanced array of equipment includes:

  • Advanced Orbotech Discovery Series automated optical inspection equipment
  • CCD Drill / Multilayer tooling capability
  • Laser Direct Imaging (LDI)
  • CCD Photo imaging using glass tooling
  • Toolless Inkjet Silkscreen Printing
  • X Ray fluorescence metallurgical analysis
  • X Ray inspection system
  • Flying probe electrical testing
  • Handheld Cu thickness measurement
  • High resolution microscopic cross section image capture