Technology

Day in and day out, we build countless PCB's that incorporate blind, buried, filled, planarized and plated shut vias.


We also build several designs that utilize pocket cavities. To insure quality, all panels contain reliability coupons per IPC-2221 that are used for both in process and final inspection criteria.

Capabilities

Download Capabilities Sheet


* Six drill machines, up to 300K/RPM spindles for mechanical drilling uVia's (0.004" diameter)

* Laser Drill for flexible PCB manufacturing

* CCD drilling and routing capability for higher precision as well as backdrill depth control

* Pneumatic via fill to improve speed, quality, and consistency of via fill process

*Tool less Inkjet Silkscreen printing

*X Ray fluorescence metallurgical analysis

* Automated planarization equipment to enable tighter control of copper removal during the process.

* Reverse Pulse Plating for high aspect ratio and uniform plating consistency on surfaces and holes

* New flying probe tester for additional capacity and redundancy



Equipment

In pursuit of our quality goals, Netvia Group has invested heavily in equipment and training.


Our advanced array of equipment includes:

  • ESI 5335 Laser Drill
  • LENZ DLG550 2+2 Drill
  • Micro Vu Excel 661UC Precision Measurement System
  • Advanced Orbotech Discovery Series automated optical inspection equipment
  • CCD Drill / Multilayer tooling capability
  • Laser Direct Imaging (LDI)
  • CCD Photo imaging using glass tooling
  • Glenbrook X Ray machine 
  • DP 1500 Screen Printer
  • Fabcon ATI-30 Optical Registration System
  • Microcraft EMMA E4M6151 flying probe electrical testing
  • Handheld Cu thickness measurement
  • High resolution microscopic cross section image capture
  • Multiline Post Etch Punch